The online BGA/CSP chip cleaning machine is a streamlined cleaning equipment that installs the ultrasonic vibrating plate on the conveying line.

The product does not need to be loaded into a basket, which saves manpower, saves time, has high efficiency and large output, and can realize fully automatic continuous production. It is widely used in cleaning chips, glass, heat sinks, fixtures and other industries and products.

The photoresist residue on the surface of the wafer is removed by SPM cleaning. SPM has a high oxidation ability, can oxidize the organic matter of the photoresist to generate CO₂ and H₂ 0 and can also dissolve the metal into the cleaning solution after oxidation. Main process flow: SPM pickling, QDR rinsing, ultrasonic cleaning, overflow rinsing

APM (SC-1) is an alkaline solution of H₂.0₂ and NH₄.OH, through H₂O₂ Strong oxidation and the dissolution of NH₄.OH make organic contamination into water-soluble compounds, which are eliminated with deionized water washing. Due to the strong oxidizing and complexing properties of the solution, it can oxidize Cr, Cus, Zn Ag, Ni. Co. CaFe, Mg, etc. to make them into high-valent ions, and then further react with alkali to form soluble complexes, which are dissolved with deionized water. are removed by washing. For this reason, cleaning the polishing sheet with SC-1 solution can remove both organic contamination and certain metal contamination.

DHF can remove the natural oxide film on the surface of the silicon wafer, and the metal attached to the natural oxide film will be dissolved in the cleaning solution, which can remove Al, Fe, Zn, Ni and other metals on the surface of the silicon wafer. DHF can also remove metal hydroxide attached to the natural oxide film. When cleaning with DHF, the natural oxide film is corroded, and the silicon on the surface of the silicon wafer is hardly corroded.

Features:

* Clean 30 suction nozzles at a time, with short cleaning time and high efficiency.
* Instead of traditional manual cleaning, it solves the problem of ultrasonic cleaning and reduces the phenomenon of patch throwing.
* Atomized water flow supersonic jet cleaning, thoroughly solves the dirt and impurities that cannot be cleaned by ultrasonic waves.
* The cleaning will not be unclean due to the smaller and smaller nozzle aperture.
* Cleaning is more thorough, directly prolonging the life of the suction nozzle, and the cleaning rate is over 99%.
* Easy to operate, the interface can be switched between Chinese and English.
* Never use cleaning agent, only clean with environmentally friendly pure water or deionized water.
* Using touch screen control interface, the operation is simple and easy to understand.
* It is suitable for all kinds of placement machine nozzles, and the cleaning effect is more obvious for cross-shaped, I-shaped and special-shaped nozzles.

1. Features: Customized according to customer needs, it can handle corrosion, cleaning, ultrasonic, heating, drying, loading, spraying, pickling, rinsing, blanking and other processes.
2. The control mode can be selected: manual or automatic.
3. Material: According to customer and process requirements, PP, PVC, PVDF, quartz, stainless steel and other materials can be selected to ensure the durability of the equipment.
4. The bottom of the tank body is an inclined funnel structure, which is convenient for cleaning and slag discharge.
5. The equipment is equipped with a rotating device to achieve a better cleaning effect on the workpiece; the top is equipped with a mist removal system combined with an acid mist tower to treat waste mist and wastewater to avoid polluting the environment.
6. PLC control man-machine interface operation display can change the cleaning parameters according to the actual situation.

1. Material: PPN, PP (polypropylene) PVDF (polytetrafluoroethylene) SUS (corrosion-resistant steel) – chemical corrosion resistance.
2. Composition: frame, mechanical handling part (loading and unloading table, manipulator), cleaning main body, ventilation system, electric control system, etc.
3. Function: to clean away the pollutants, metal ions, oxides, etc. attached to the surface of the silicon material.

1. Scope of application: circuit board production; pre-treatment of PCB solder paste printing; Wire Bong process; BGA mounting pad treatment; pre-treatment of PCB coating conformal paint; PCB electronic waterproof coating.
2. Atmospheric pressure plasma surface treatment-Advantages: environmental protection, no chemical solvents are required; low cost, only electricity and air are needed; dry cleaning, simple cleaning process; atmospheric pressure treatment, no need for vacuuming, high efficiency, and online cleaning.

1. Wafer cleaning machine (semiconductor, mobile phone camera).
Ø Dedicated to cleaning wafers (Wafer) or glass surface dust after cutting, high-speed centrifugal dehydration, no water marks left on the surface of the workpiece.
Ø The use of two-fluid cleaning device can effectively improve the cleaning effect.
Ø Equipped with anti-static ion wind system.
Ø Equipped with an air filtration system, the use of compressed air is cleaner.
Ø The overall stainless steel mirror body is strong and durable, resistant to acid, alkali and other cleaning fluids.

Device parameters:

Features:

◆Modular design;
◆Sturdy design improves stability;
◆Ergonomically designed, so that the arms are not easy to fatigue;
◆Smooth and parallel width screw adjustment method;
◆Optional circuit board detection mode;
◆Customize machine length according to customer requirements;
◆Can change the speed control;
◆SMEMA standard four-core signal line, which can be directly connected to other equipment
use.