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For the cleaning of SMT Stencil, copper mesh, wire mesh, microporous mesh and wafer disk in the electronics industry;
Th e e q u i p m e n t c o m p l e t e l y u s e s compressed air as energy, does not use electricity, and does not have any fire hazards. It adopts humanized design, one-button operation, and easily completes the cleaning and drying work; it is a fully automatic operation using air pressure from cleaning to d r y i n g . Ad v a n c e d h i g h – p e rf o r m a n c e pneumatic automatic cleaning equipment; the cleaning fluid is recycled and the loss is low;
| Applicable steel mesh size | L1600/750*W750~H40 (mm) (large size needs to be customized) |
| Stencil Quantity | 1 sheet |
| Cleaning fluid capacity | 40L (maximum) |
| Optimal Liquid Usage | 30L |
| cleaning method | 360°rotary cleaning liquid spray and high-pressure air spray(cleaning one> dry) |
| cleaning time | 2~5 minutes (conventional process) |
| drying time | 2~5 minutes (conventional process) |
| external air source | 0.45mpa~0.7mpa |
| Tin slag filtration method | Using three-stage filtration |
| over grade | 10um (filter impurities and labels) |
| 2 stage filtration | 5um (filter small particles and solder paste) |
| 3 stages of filtration | 1um (filter small particles and rosin) |
| Exhaust port size | Φ120*25H (mm ) |
| Machine net weight | 200kg |
| Machine size | L945*W650*1650 (mm) |
| 重量 | 200 公斤 |
|---|---|
| 尺寸 | 160 × 75 × 4 厘米 |
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